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Responsibilities
- Lead development and roadmap creation for advanced and disruptive packaging technologies (hybrid bonding, TSV, fan-out, SiP, flip chip, SMT, solder ball attach, and assembly processes)
- Establish and manage relationships with foundries, OSATs, substrate suppliers, and material suppliers to support package development activities
- Influence and align OSAT and foundry partners' roadmaps with Meta's custom silicon packaging roadmap
- Collaborate cross-functionally with internal teams (silicon design, architecture, system, thermal, mechanical) and external partners (design houses, OSATs, substrate vendors) to ensure manufacturability, integration, and reliability
- Support test vehicle (TV) design, process feasibility, simulation, and design rule/DFM checks with emphasis on thermo-mechanical reliability
- Drive Design of Experiments (DOEs) for initial builds, product qualification, and sustaining activities
- Lead triage efforts for unexpected inline process, equipment, and quality issues; drive root cause failure analysis (FA) and corrective actions with partners
- Evaluate and address chip-package interaction (CPI) effects, board-level reliability (BLR), and component-level reliability (CLR) through simulation, testing, and data analysis
- Track technology gaps, reliability risks, and yield issues; compile and maintain POR, TOR, FMEA, and related KPIs
- Stay updated on advanced packaging technologies and market trends and identify emerging technologies
- Travel both domestically and internationally up to 10% of the time
Minimum Qualifications
- Bachelor's degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience
- 12+ years of experience in advanced silicon packaging development, process integration, and manufacturing
- Ability to work with mechanical and thermal constraints to co-optimize package architecture for demanding form factors
- Demonstrated cross-functional collaboration with internal teams and external partners (foundry, OSAT, substrate vendors, ODMs)
- Experience taking products from concept to prototyping and production, including manufacturing specifications, vendor qualifications, and yield/cost optimization
- Bachelor's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, or a relevant technical field
Preferred Qualifications
- Master's or PhD degree in a relevant engineering discipline
- Experience with board-level and component-level reliability testing and qualification (JEDEC standards)
- Strong DOE methodology, statistical data analysis, and process characterization skills
- Experience driving failure analysis (FA) — including physical FA techniques, fault isolation, and root cause determination
- Excellent problem-solving and communication skills; the ability to influence cross-functional stakeholders
- Track record of successful complex package product qualification with OSATs
- Experience with a broad range of packaging technologies: WLCSP, fan-out RDL, WoW, CoW, PoP, SiP, flip chip, and 3D stacking
- Strong understanding of chip-package interaction (CPI), thermo-mechanical stress, and warpage management
- Ability to work independently, manage multiple programs, and travel internationally (typically once per quarter)
$212,000/year to $294,000/year + bonus + equity + benefits
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